@INPROCEEDINGS{Unger2018,
  author = {Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Br{\"o}kelmann,
	Michael and Sextro, Walter},
  title = {Intelligent Production of Wire Bonds using Multi-Objective Optimization
	– Insights, Opportunities and Challenges},
  booktitle = {In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
	Pasadena, CA, 2018},
  year = {2018},
  volume = {Vol. 2018, No. 1, pp. 000572-000577.},
  abstract = {Ultrasonic wire bonding is an indispensable process in the industrial
	manufacturing of semiconductor devices. Copper wire is increasingly
	replacing the well-established aluminium wire because of its superior
	electrical, thermal and mechanical properties. Copper wire processes
	differ significantly from aluminium processes and are more sensitive
	to disturbances, which reduces the range of parameter values suitable
	for a stable process. Disturbances can be compensated by an adaption
	of process parameters, but finding suitable parameters manually is
	difficult and time-consuming. This paper presents a physical model
	of the ultrasonic wire bonding process including the friction contact
	between tool and wire. This model yields novel insights into the
	process. A prototype of a multi-objective optimizing bonding machine
	(MOBM) is presented. It uses multi-objective optimization, based
	on the complete process model, to automatically select the best operating
	point as a compromise of concurrent objectives.},
  doi = {10.4071/2380-4505-2018.1.000572},
  keywords = {wire bonding, multi-objective optimization, process model, copper
	wire, self-optimization},
  owner = {ekubi},
  timestamp = {2018.10.29},
  url = {https://imapsource.org/doi/10.4071/2380-4505-2018.1.000572}
}