@INPROCEEDINGS{Schemmel2019a,
  author = {Schemmel, R. and Hemsel, T. and Dymel, C. and Hunstig, M. and Br{\"o}kelmann,
	M. and Sextro, W.},
  title = {Using complex multi-dimensional vibration trajectories in ultrasonic
	bonding and welding},
  booktitle = {Sensors and Actuators A: Physical},
  year = {2019},
  volume = {295},
  pages = {653-662},
  month = {August},
  abstract = {Ultrasonic joining is a common industrial process. In the electronics
	industry it is used to form electrical connections, including those
	of dissimilar materials. Multiple influencing factors in ultrasonic
	joining are known and extensively investigated; process parameters
	like ultrasonic power, bond force, and bonding frequency of the ultrasonic
	vibration are known to have a high impact on a reliable joining process
	and need to be adapted for each new application with different geometry
	or materials. This contribution is focused on increasing ultrasonic
	power transmitted to the interface and keeping mechanical stresses
	during ultrasonic bonding low by using a multi-dimensional ultrasonic
	transducer concept. Bonding results for a new designed connector
	pin in IGBT-modules achieved by multi- and one-dimensional bonding
	are discussed.},
  comment = {Preprint: \url{https://groups.uni-paderborn.de/ldm/publications/download/Schemmel2019a.pdf}},
  doi = {10.1016/j.sna.2019.04.025},
  file = {Schemmel2019a.pdf:download\\Schemmel2019a.pdf:PDF},
  owner = {ekubi},
  timestamp = {2019.07.01}
}