@INPROCEEDINGS{Schemmel2018_b,
  author = {Schemmel, Reinhard AND Tobias Hemsel AND Sextro, Walter},
  title = {NUMERICAL AND EXPERIMENTAL INVESTIGATIONS IN ULTRASONIC HEAVY WIRE
	BONDING},
  booktitle = {6th European Conference on Computational Mechanics (ECCM 6)},
  year = {2018},
  pages = {1-12},
  address = {Glasgow, UK},
  month = {Juni},
  abstract = {Ultrasonic wedge/wedge-wire bonding is used to connect electrical
	terminals of semiconductor modules in power electronics. The wire
	is clamped with a tool by a normal force and ultrasonic vibration
	is transmitted through the wire into the interface between wire and
	substrate. Due to frictional processes contaminations like oxide
	layers are removed from the contact zone and the surface roughness
	is reduced, thus the real contact area is increased. In the next
	step of bond formation, thermomechanical forces create micro-junctions
	between the wire and substrate and the bond strength increases. 
	
	The bond parameters like the bond normal force, the ultrasonic vibration
	amplitude and the geometry of the clamping tool show a high influence
	on the strength and reliability of the wire bond and need to be investigated
	in detail. Therefore, in this contribution the dynamical behaviour
	of the ultrasonic system, the wire and the substrate are modeled
	in form of substructures, which are connected by the friction contacts
	between tool and wire and between wire and substrate. Approaches
	for modelling the time variant contact behaviour, the substrate dynamics,
	and the model order reduction for a time efficient simulation are
	described to simulate the full bonding process.},
  comment = {Preprint: \url{https://groups.uni-paderborn.de/ldm/publications/download/Schemmel2018b.pdf}},
  file = {Schemmel2018b:download\\Schemmel2018b.pdf:PDF},
  owner = {ekubi},
  timestamp = {2018.06.29}
}