@INPROCEEDINGS{Schemmel2018,
  author = {Schemmel, Reinhard AND Simon Althoff AND Michael {Br{\"o}kelmann}
	AND Andreas Unger AND Matthias Hunstig AND Sextro, Walter},
  title = {Effects of different working frequencies on the joint formation in
	copper wire bonding},
  booktitle = {CIPS 2018 - 10th International Conference on Integrated Power Electronics
	Systems (CIPS 2018)},
  year = {2018},
  pages = {230-235},
  address = {Stuttgart, Germany},
  month = {März},
  abstract = {Ultrasonic wire bonding is used to connect the electrical terminals
	of semiconductor modules in power electronics. Mul-
	
	tiple influencing factors in wedge/wedge bonding are known and extensively
	investigated. A constructively settable but
	
	rarely examined parameter is the bonding frequency. In case of bonding
	on challenging substrates, e.g. supple substruc-
	
	tures, a high influence of the working frequency is observed. The choice
	of the working frequency is typically based on
	
	experimental investigations for a certain component or substrate and
	needs to be evaluated anew for new applications. A
	
	profound understanding of the influence of the working frequency is
	required to achieve a reliable bond process and a
	
	short process development. Here a generalized model for the numerical
	simulation of the bond formation with respect to
	
	the dynamics of the substructure is presented. The simulation results
	are compared to experiments using 300 µm copper
	
	wire at different working frequencies and geometries of the substructure.},
  comment = {Preprint: \url{https://groups.uni-paderborn.de/ldm/publications/download/Schemmel2018.pdf}},
  file = {Schemmel2018.pdf:download\\Schemmel2018.pdf:PDF},
  owner = {ekubi},
  timestamp = {2018.04.16}
}