@INPROCEEDINGS{Eichwald2013,
  author = {Paul Eichwald AND Walter Sextro AND Simon Althoff AND Florian Eacock
	AND Mark Schnietz AND Karsten Guth AND Michael Br{\"o}kelmann},
  title = {Influences of Bonding Parameters on the Tool Wear for Copper Wire
	Bonding},
  booktitle = {15th Electronics Packaging Technology Conference},
  year = {2013},
  abstract = {Ultrasonic wire bonding is a common technology for manufacturing electrical
	interconnects. In the field of power electronics, new thermal and
	electrical obligations arose due to increasing power density requirements.
	One approach to achieve these aims is replacing the wire material
	for heavy wire bonds from aluminum to copper. This material change
	leads to challenging tasks and problems, for instance the occurring
	wear of the bond tool. The wear is significantly higher using copper
	wire instead of aluminum and results in a dramatic loss in the amount
	of interconnects which can be produced reliable by a single tool.
	To reduce setting-up time in the production and minimizing costs,
	an enlarged bonding tool lifetime is desirable. Therefore, the paper
	discusses the influences of bonding parameters on the wear. 
	
	
	The key question is which of the tasks cannot be fulfilled with increased
	wear of the tool, e.g. loss of process capability. The main functions
	are fixing the wire in the tool groove, predeformation, applying
	normal force and transmission of ultrasonic oscillation to the wire.
	To identify the most affecting factors, four bonding parameters are
	varied and their influences are investigated. These parameters are:
	(I) ultrasonic power, (II) tool geometry, (III) the way of tangential
	force transmission and (IV) loop trajectory.},
  doi = {10.1109/EPTC.2013.6745803},
  file = {Eichwald2013.pdf:Eichwald2013.pdf:PDF},
  timestamp = {2014.01.09}
}