@INPROCEEDINGS{Dymel2018b,
  author = {Dymel, Collin and Schemmel, Reinhard and Hemsel, Tobias and Sextro,
	Walter and Brökelmann, Michael and Hunstig, Matthias},
  title = {Experimental investigations on the impact of bond process parameters
	in two-dimensional ultrasonic copper bonding},
  booktitle = {(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018),
	Kyoto, Japan)},
  year = {2018},
  pages = {41-44},
  abstract = {Ultrasonic bonding and welding are common 
	
	friction based approaches in the assembly of power electronics.
	
	
	Interconnections with cross-sections of 0.3 mm² up to 12 mm²
	
	
	made from copper are well suited in high power applications. For 
	
	increasing friction energy, which is responsible for bond 
	
	formation, a two-dimensional vibration approach is applied to 
	
	newly developed interconnection pins. Using two-dimensional 
	
	vibration for bonding requires identification of suitable bonding
	
	
	parameters. Even though simulation models of wire bonding 
	
	processes exist, parameters for the two-dimensional pin-bonding 
	
	process cannot be derived accurately yet. Within this 
	
	contribution, a methodology and workflow for experimental 
	
	studies identifying a suitable bond parameter space are 
	
	presented. The results of a pre-study are used to set up an 
	
	extensive statistical parameter study, which gives insights about
	
	
	the bond strength change due to bond process parameter 
	
	variation. By evaluation of electrical data captured during
	
	
	bonding, errors biasing the resulting shear forces are identified.
	
	
	All data obtained during the experimental study is used to build a
	
	
	statistical regression model suitable for predicting shear forces.
	
	
	The accuracy of the regression model’s predictions is determined 
	
	and the applicability to predict process parameters or validate
	
	
	simulation models is assessed. Finally, the influence of the tool
	
	
	trajectory on the bond formation is determined, comparing one 
	
	dimensional, elliptic and circular trajectories.},
  comment = {Preprint: \url{https://groups.uni-paderborn.de/ldm/publications/download/Dymel2018b.pdf}},
  file = {Dymel2018b.pdf:download\\Dymel2018b.pdf:PDF},
  keywords = {ultrasonic two-dimensional bonding, electrical interconnection, process
	parameters},
  owner = {ekubi},
  timestamp = {2018.11.05}
}