@INPROCEEDINGS{Dymel2018a,
  author = {Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel,
	Tobias and Br{\"o}kelmann, Michael and Hunstig, Matthias and Sextro,
	Walter},
  title = {Numerical and statistical investigation of weld formation in a novel
	two-dimensional copper-copper bonding process},
  booktitle = {(Proceedings of 7th Electronics System-Integration Technology Conference,
	Dresden, Germany)},
  year = {2018},
  pages = {1-6},
  abstract = {State-of-the-art industrial compact high power 
	
	electronic packages require copper-copper interconnections with 
	
	larger cross sections made by ultrasonic bonding. In comparison 
	
	to aluminium-copper, copper-copper interconnections require 
	
	increased normal forces and ultrasonic power, which might lead 
	
	to substrate damage due to increased mechanical stresses. One 
	
	option to raise friction energy without increasing vibration
	
	
	amplitude between wire and substrate or bonding force is the use 
	
	of two-dimensional vibration. The first part of this contribution
	
	
	reports on the development of a novel bonding system that
	
	
	executes two-dimensional vibrations of a tool-tip to bond a nail-
	
	like pin onto a copper substrate. Since intermetallic bonds only
	
	
	form properly when surfaces are clean, oxide free and activated, 
	
	the geometries of tool-tip and pin were optimised using finite
	
	
	element analysis. To maximize the area of the bonded annulus the 
	
	distribution of normal pressure was optimized by varying the
	
	
	convexity of the bottom side of the pin. Second, a statistical model
	
	
	obtained from an experimental parameter study shows the 
	
	influence of different bonding parameters on the bond result. To 
	
	find bonding parameters with the minimum number of tests, the 
	
	experiments have been planned using a D-optimal experimental 
	
	design approach.},
  comment = {Preprint: \url{https://groups.uni-paderborn.de/ldm/publications/download/Dymel2018a.pdf}},
  file = {Dymel2018a.pdf:download\\Dymel2018a.pdf:PDF},
  keywords = {ultrasonic wire-bonding, bond-tool design, parameter identification,
	statistical engineering},
  owner = {ekubi},
  timestamp = {2018.11.05}
}