@INPROCEEDINGS{Althoff2015,
  author = {Simon Althoff AND Andreas Unger AND Walter Sextro AND Florian Eacock},
  title = {Improving the cleaning process in copper wire bonding by adapting
	bonding parameters},
  booktitle = {2015 17th Electronics Packaging Technology Conference},
  year = {2015},
  pages = {1-6},
  abstract = {Changing manufacturing technologies or material in well-known processes
	has to be followed by an adaption of process parameters. In case
	of the transition from aluminum wire to copper wire in heavy wire
	bonding, the adaption effort is high due to the strongly different
	mechanical properties of the wire. One of these adaption aspects,
	apart from wire material, is the existent oxide layers on wire and
	substrate. The ductile aluminum oxide is not influencing the bonding
	process much, because it is supposed to break apart in case of plastic
	deformation. The lubricating copper oxide layer has to be removed
	before micro welds can develop. Therefore, in this paper, experiments
	are carried out at low frequency to determine the friction energy
	needed to abrade the copper oxide layer of wire and substrate, which
	is indicated by an increase in the resulting friction coefficient.
	The friction energy per contact area to remove the interfering layers
	at low frequency is compared to the real bonding process working
	at 58 kHz. In addition, a theoretical concept is being described
	to get a grasp of the occurring mechanism. In the end a proposal
	is given how to set bonding parameters to get the cleanest surfaces
	with the installed bond tool.},
  doi = {10.1109/EPTC.2015.7412402},
  file = {Althoff2015.pdf:Althoff2015.pdf:PDF},
  owner = {tobiasm},
  timestamp = {2015.12.09}
}