@INPROCEEDINGS{Althoff2013,
  author = {Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter},
  title = {A friction based approach for modeling wire bonding},
  booktitle = {IMAPS 2013, 46th International Symposium on Microelectronics},
  year = {2013},
  address = {Orlando (Florida), USA},
  abstract = {A model approach for wedge/wedge bonding copper wire is presented.
	The connection between wire and substrate is based on a variety of
	physical effects, but the dominant one is the friction based welding
	while applying ultrasound. Consequently, a friction model was used
	to investigate the welding process. This model is built up universal
	and can be used to describe the formation of micro welds in the time
	variant contact area between wire and substrate.
	
	
	Aim of the model is to identify the interactions between touchdown,
	bond normal force, ultrasonic power and bonding time. To do so, the
	contact area is discretized into partial areas where a Point Contact
	Model is applied. Based on this approach it is possible to simulate
	micro and macro slip inside the contact area between wire and substrate.
	The work done by friction force is a main criterion to define occurring
	micro joints which influence the subsequent welding.},
  doi = {10.4071/isom-2013-TA67},
  file = {Althoff2013.pdf:Althoff2013.pdf:PDF},
  keywords = {Wire bonding, friction modeling, wire bond quality, contact element
	modeling},
  timestamp = {2014.01.10}
}