Ivan Ndip

 

 

 

 

 

 

E-mail:

ndip@izm.fraunhofer.de

From 1st November 2003 to 30th September 2005 Ivan Ndip was engaged in the modelling and optimisation of chip packages for RF applications, e.g. BGA's, in the context of the collaboration with the Fraunhofer-Institute of Reliability and Microintegration .