Uzzal Binit Bala

E-mail:

uzzal.bala@pb.izm.fraunhofer.de

Dr.-Ing. Uzzal Binit Bala was with the chair of high-frequency electronics as postdoc from 1st August 2007 to 31st January 2010. In the frame of the European PIDEA+ project EMCpack/FASMZS and together with besides other partners Fraunhofer IZM/ASE Paderborn he investigated innovative packaging solutions for integrated systems by electro-magnetic field simulation. He changed to University Kiel, Germany.