Uzzal Binit Bala
Dr.-Ing. Uzzal Binit Bala was with the
chair of high-frequency electronics as postdoc from 1st August
2007 to 31st January
the frame of the European
PIDEA+ project EMCpack/FASMZS and together with besides other partners Fraunhofer IZM/ASE Paderborn he investigated innovative
packaging solutions for integrated systems by electro-magnetic field simulation. He changed to University Kiel, Germany.